
	Trending ▼ ICSE CBSE 10th ISC CBSE 12th CTET GATE UGC NET Vestibulares ResFinder

2003 Course Electronic Product Design

3 pages, 39 questions, 0 questions with responses, 0 total responses,

	pune_eng	+Fave Message
	Profile Timeline Uploads Q & A

Home > pune_eng >

Instantly get Model Answers to questions on this ResPaper. Try now!
NEW ResPaper Exclusive!

Formatting page ...

Total No. of Questions : 12] [Total No. of Pages : 3 [3664] - 196 P 1346 B.E. (E & TC) ELECTRONIC PRODUCT DESIGN (2003 Course) Time : 3 Hours] [Max. Marks : 100 Instructions to the candidates: 1) Answer 3 questions from Section I and 3 questions from Section II. 2) Answers to the two sections should be written in separate books. 3) Figures to the right indicate full marks. 4) Use of electronic pocket calculator is allowed. 5) Assume suitable data, if necessary. SECTION - I Q1) a) b) Discuss in details different stages of an electronic product development. Explain importance of each stage in detail. [10] What is need of slowing down the rise/fall time of high frequency clock. Find amount of rise time offered by simple RC low pass circuit with [8] R = 56 , C = 47 PF to 20 MHz clock. OR Q2) a) b) Q3) a) b) c) With the help of a practical example of data acquisition system, establish the technocommercial feasibility of product. [8] Explain in detail how the power supply requirement for an electronic product containing 4 x 4 matrix keyboard, 16 x 2 LCD display, a micro controller, few CMOS digital ICS, OP AMP and ADC TS estimated. What is safety margin kept between calculated and actual power supply capacity. [10] A micro controller system is to be operated at 300 MHz clock frequency. What are the PCB design considerations for such a system. What type of PCB will be used to implement circuit. Justify. [8] Two tracks on PCB having laminate thickness of 3.5 mm and r = 4.7 have an overlap area of 8 cm2. What will be the capacitance between two tracks. [4] Calculate resistance of 30 cm long copper track with 2.00 mm width on standard 70 micron copper clad laminate. = 4 ohm cm for copper. [4] OR P.T.O. Q4) a) b) c) Q5) a) b) Explain in brief the recommendations for placing following components on PCB. [8] i) Electromagnetic relay. ii) IGBT with heat sink. iii) 40 pin FRC connector. iv) 555 timer IC. Different logic family circuits should not be mixed together. Justify.[4] Explain different termination schemes for high speed circuits. [4] Draw the circuit diagram of pushpull class B amplifier and explain how can be applied DC or operating point analysis and transient analysis. [8] Explain how simultaneous state and timing mode of Logic Analyser helps in fault finding of high speed digital designs. [8] OR Q6) a) b) Explain advantages and limitations of i) Analog Real time oscilloscope. ii) Digital storage oscilloscope. Also explain where mixed signal oscilloscope will find applications. [8] What are advantages of DPO over DSO? Give typical application of DPO with procedure for measurement. [8] SECTION - II Q7) What are desirable features of Assemblers and cross compilers? Explain use of each in testing software with the help of practical example. [18] OR Q8) Write notes on [18] a) Modular programming. b) Steps from coding to generation of executable code when using a combination of Assembly language and C language programs. c) Real time softwares. d) In circuit Emulator. Q9) a) b) Explain types of temperature tests to be carried out on an industrial product. [8] Specify with justification the choice of environmental tests to be carried out on following products. [8] i) UPS. ii) TV receiver. iii) ECG machine. [3664] - 196 -2- OR Q10)For each of the products listed below : [16] a) Classify according to their electromagnetic compatibility. b) Whether emission or susceptible test of EMI is necessary. c) Which of four generic types of EMI/EMC tests should be conducted on them? d) Identify the mechanism by which the product becomes a case of EMI/ EMC. Products : i) Mobile telephone. ii) MRI machine. iii) Stepper motor drive. iv) Relay operated on/off controller. Q11)In product documentation, explain importance and typical contents of following documents. [16] a) Front panel. b) Schematic diagram. c) Interconnection diagram. d) Bill of material. e) PCB assembly. OR Q12)For a PLC setup what should be contents of [16] a) User manual. b) Service manual. Explain how each section of these manuals is to be used by concerned persons. [3664] - 196 -3-

Formatting page ...

Tags : Pune, Engineering, University of Pune, Engineering question papers, Pune University, previous year question papers, question papers, india, model question paper, pune university paper pattern, pune university syllabus, old question papers

pune_eng chat

Horizontal lines at:
Guest Horizontal lines at:
AutoRM Data:
Box geometries: